Beijing Fareast Deli Technology Co., Ltd.

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PCB/ Printed Circuit Board/ Single-sided PCB

Product Details:

Base Material	FR-4
Min. Line Spacing	0.1mm
Surface Finishing	HASL/ENIG/Chemical immersion g
Min. Line Width	0.1mm
Min. Hole Size	0.075mm
Board Thickness	0.2mm-5.0mm
Place of Origin	Beijing, China
Brand Name	Buyer's brand
Model Number	DL0054

Payment & Shipping Terms:

Minimum Order Quantity:	1 Piece/Pieces
Packaging Details:	according to your needs
Delivery Time:	30 days
Payment Terms:	L/C,T/T
Supply Ability:	20000 Square Meter per Month

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Detailed Product Description

Our capability is as below:

ITEM		TECHNICAL PARAMETER
Layers		1-16Layers
MaxMfgsize	Double/Single sided PCB	550×710mm
	Multilayer PCB	550×710mm
Board Thinkness		0.2mm-5.0mm
Minimum Trace Width		0.1mm
Minimum Trace Clearance		0.1mm
Minimum Hole Diameter	Mechanical Drilling	0.2mm
	laser drilling	0.075mm
Hole Plating Thickness		≥25um
PTH Hole Tolerance	≤0.8mm	Plus or Minus 0.05mm
	0.8mm	Plus or Minus 0.1mm
Hole position Deviation		Plus or Minus 0.05mm
Outline Tolerance		Plus or Minus 0.13mm
Insulation Resistance		10¹²
Through Hole Resistance		≤300u
Dialectric Strength		≥1.6kv/mm
Current Breakdown		10A
Peel Off Strength		1.5N/mm
Solder Mask Abrasion		5H
Thermal Strength		288/3X per 10 Seconds
Inflammability		UL94 V-0
E-Test Voltage		10-500V
Pull Off Strength of Pads		100N
Solder Ability		235 Degrees Celsius Withing 3s Seconds
Bow and Twist		0.01mm/mm

HWA
Specifications
Sn/Pb thickness:2-25um
Sn/Pb proportion:63:37
Shelf life: 24 months
Characteristics:very good wetting ability Proven method

Electroless Gold
Specifications
Ni thickness:2.5-8um
Au thickness:0.02-0.08um
Shelf life:18 months
Characteristics
smooth surface,Stability in soldering ,good wear ability in soldering

Electrolytic Ni/Au
Technical Data:
Ni thickness:2.5-6um
Au thickness:0.02-0.12um
Characteristics
The surface of the Electrolytic Ni/Au is consistent and smooth,fits high density SMT and Bonding.

Clemical Sliver
Specifications:
he solderablity
Flat surface;good for applying BGA,7C,COB,
Can be used by press -fit techonlogy
Withstands very low temperatures
Good bonding abilityGood conductivityLow cost

Impedance
Specifications:
Control resistance:50-100 omegas Accuracy:/-10%
Testing Accuracy:500omega ,
100omega=1.5%
Characteristics
Accures the transmission quality of high-frequency and speed signals

Plugged Vias
Specifications:
Hole diameter0.25-0.8um
Depth30%-100%
Material:LP2
CharacteristicsAssured quality,protects BGA against shorts.

Peel-Away Glue
Specifications:
Peel thickness:0.3-0.6mmRe-solder ability:1-2 times
Characteristics
Efficient in protecing soldering area

Blind&Buried viasHDI Board
Process method:
Build-up technology
Characteristics
Reduce electromagnetic and ratio frequency interference,perfect signal transmission

Machine

Laser Drilling Machine---- Japanese Hitachi Company

Etching machine-------Italy, IS Company

Plating Line-------Taiwan, Xitai Company

Parallel Exposure--------Taiwan, Zhisheng Company

CNC Routing Machine------Italy, PLURITEC Company.

Ionic Contamination Test System------USA, Alphametals Inc

SM/Exposer The ambition saint company of Taiwan

Italy PLURITEC NC Router

More than 20 years experience of manufacturing PCB

Provide you not only the prototype but PCB with big quantity at competitive prices

what we can offer:
Standard PCB	Single-sided PCB
	Standard Layers:2,4,6,8
	Flex & Flex-Rigid PCB
Special PCB	Complex Flex-Rigid PCB (Rigid up to 20 layers)
	HDI PCB--Blind, buried vias, Laser drilled vias
	Heavy copper PCB- up to 12oz
	Hard gold PCB/Halogen free PCB
	Metal based PCB
	High Frequency PCB/TG PCB

Lead Times

Prototype (Up to 3 dm²)	SS-DS-4L-6L-8L-10L	2-5 Working days
Prototype (Up to 3 dm²)
Series	Rigid	10-20 Working days
	Flex	10-20 Working days
	Flex-Rigid	15-25 Working days